Grand Idea Studio

News Archive

Joe Grand Joins MetaSensor Advisory Board

Monday, Feb 8th, 2016

Joe Grand of Grand Idea Studio has joined the Advisory Board for MetaSensor. MetaSensor is developing a new generation of Internet of Things (IoT) devices that improve situational awareness using real-time processing and machine learning capabilities. Since February 2014, Joe has been providing general guidance and recommendations for MetaSensor’s business development, engineering, and manufacturing processes. [ continue ]

PCB Deconstruction Videos Released

Wednesday, Mar 4th, 2015

Grand Idea Studio has released a series of videos to supplement their PCB Deconstruction Techniques research. The videos show actual processes and results of solder mask removal, delayering, and imaging techniques used in the deconstruction of printed circuit boards (PCBs). Grand Idea Studio’s research will primarily benefit the cyber security community and those involved in failure analysis and reverse engineering of electronic products. [ continue ]

Joe Grand to Judge The Hackaday Prize

Monday, Apr 28th, 2014

Joe Grand of Grand Idea Studio has been selected as a judge for the The Hackaday Prize. This design contest challenges hardware hackers to change their world by creating open, connected devices. Joe, along with a panel of other judges, will assess project submissions and determine the top entries. The Hackaday Prize boasts the richest and most compelling prize pool ever available to hardware hackers, including a trip to space for the grand prize winner. [ continue ]

DARPA Cyber Fast Track Contract Received

Tuesday, Jun 4th, 2013

Grand Idea Studio has received a commercial contract from DARPA’s Cyber Fast Track program, which is a groundbreaking effort designed to fund short term, revolutionary security projects. The funded contract, entitled Research and Analysis of PCB Deconstruction Techniques, aims to research, test, characterize, and document a variety of techniques useful in the deconstruction of a printed circuit board (PCB). [ continue ]

Design Patent Granted for Heat-Sealed Waste Disposal

Tuesday, Aug 14th, 2012

Joe Grand of Grand Idea Studio along with Brenda Berg, John Fiegener, Tom Gernetzke, Bill Liteplo, Neil McDaid, Billy Vespa, and Sam Wald have been granted patent #D665,551 by the U.S. Patent and Trademark Office. The patent describes an ornamental design for a heat-sealing waste disposal unit. [ continue ]

Press

Ars Technica

Badge life: The story behind ...

NXP Semiconductors

Meet Joe Grand aka Kingpin, the ...

MacroFab Engineering Podcast

What You Are Designed To Do – A ...